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IC Package/Substrate Report

IC Package/Substrate Report
~ Advanced IC Substrates (Flip Chip substrates/ 2.x D Interposer) ~
~ Study of Market & Technology trends ~

Focal points of the Report

- Study of IC substrates and related semiconductor package technology, electronic materials
- Market and Technology analysis for IC substrates by key applications: 
    (Processors for Server/Mobile SOC/Processors for PC/Memory IC)
- Market size forecast through 2032, based on volume & value
- Manufacturers share based on volume & value
- Case study of IC substrate manufacturers: 14 companies

Table of Contents

Chapter 1 Market and Technology Trends for IC Package/Substrate


1 Overall IC Package/Substrate trends   ...p2
     Market size forecast by IC types 
     Market size forecast by IC package types 
     Market size forecast by IC substrates
     Sales ranking of  IC substrate manufacturers
2 Trends of IC package and FCBGA substrates for server processors   ...p11
     Overview of the server processors & IC substrates industry
     Overview of the server processors & IC substrates market
     Sales volume and value of FCBGA substrates for server processors by major manufacturers
     Supply Status of FCBGA substrates for server processors
     Packaging technology trends for Server Processors
     Major Suppliers by manufacturing process of FCBGA substrates for server
     Market size forecast of FCBGA substrates for server 
3 Trends of IC package and FCBGA substrates for PC processors   ...p21
     Overview of the PC processors & IC substrates industry
     Overview of the PC processors & IC substrates market
     Market size forecast of PC processors
     Sales volume and value of FCBGA substrates for PC processors by major manufacturers
     Supply Status of FCBGA substrates for PC processors
     Packaging technology trends for PC Processors
     Major Suppliers by manufacturing Process of FCBGA substrates for PC processors
     Market size forecast of FCBGA substrates for PC processors
4 Trends of mobile SOC package and substrates   ...p34
     Overview of the mobile SOC & IC substrates industry
     Overview of the mobile SOC packages & substrates
     Trends in IC package adoption by mobile SOC manufacturers
     Structure of IC packages for mobile SOC
     Structure of IC substrates for mobile SOC
     Manufacturing process flow of MSAP
     Manufacturing process flow of ETS
     Sales volume and value of FCCSP substrates for mobile SOC by major manufacturers
     Market size forecast of mobile SOC by IC package types 
     Market size forecast of FCCSP substrates for mobile SOC
5 Trends for memory IC packages & substrates 
 5.1 Overall of memory IC   ...p53
     Overview of memory IC and substrates industry
     Overview of Memory IC package technology
     Technology and structure for DRAM packages
     Technology and structure for NAND Flash Memory packages
     Sales volume & value by memory IC substrate makers
     Market size forecast of memory IC substrates
 5.2 Trends of DRAM packages and substrates   ...p62
     Overview of DRAMs market
     Sales volume & value by DRAM substrate makers
     Market size forecast for DRAM substrates
     Background of market forecasting for DRAM substrates
 5.3 Trends of NAND Flash package & substrate   ...p71
     Market size forecast of NAND Flash Memory
     Sales volume & value by NAND Flash substrate makers
     Market size forecast of NAND Flash substrates
6 Trends of advanced IC Packages  
 6.1 Trends of 2.x D Packages & interposer   ...p79
     Competitive analysis for 2.x D Packages
     Overview of 2.x D Packages market
     Technology of 2.1D Packages & manufacturing process
     2.3D Package technology
     Glass Interposer
     2.5D Package: Si Interposer
 6.2 Co Packaged Optics/Optical waveguide   ...p87
     Trends of Co-Packaged Optics
     Manufacturing process of optical waveguide (Imprint method/ Direct exposure method/ Dry etching method)
     Overview of Optical waveguide materials
 6.3 Microfabrication technology   ...p93
     Outlook of microfabrication technology for IC substrates 
     Nanoimprint method

Chapter 2 Market trend for IC Substrate & related material

 
1 Overall of IC substrate market   ...p97
     Market size forecast by IC substrate types
     Sales volume by IC substrate makers 
2 Market trends of FCBGA substrates   ...p105
     Market size forecast for FCBGA substrates by Applications
     Sales volume & value by FCBGA substrate makers
3 Market trends of FCCSP Substrate   ...p113
     Market size forecast for FCCSP substrates by applications
     Sales volume & value by FCCSP substrate makers
4 Market trends of CCL & dielectric material for IC substrates   ...p119
     Overview of CCL & dielectric material for IC substrates IC substrate industry
     Overview of CCL & dielectric material for IC substrate market
     Market size forecast of CCL & dielectric material for IC substrates
     Sales volume & value by makers of CCL & dielectric material for IC substrates 
     Technology trends for CCL & dielectric material for IC substrates
5 Market trends of ultra-thin copper foil for IC Substrates   ...p128
     Overview of ultra-thin copper foil industry
     Suppliers list of ultra-thin copper foil
     Adaption status of ultra-thin copper foil by IC substrate types
     Market size for ultra-thin copper foil by thickness, by applications
     Sales volume & value of ultra-thin copper foil makers by thickness
     Market size forecast for ultra-thin copper foil by applications
6 Market trends of solder resist for IC Substrates   ...p137
     Adaption status of solder resist by IC substrate types
     List of solder resist makers
     Sales volume & value by makers of solder resist for IC substrates
     Market size forecast of solder resist for IC substrates

Chapter 3 Case studies of IC Substrate makers

   Company performance/ IC Substrate sales/ Sales of IC Substrates by types/ 
   Sales by customers/ Plant of IC substrate/ Investment for IC substrate business

 1. Ibiden Co., Ltd     ...p144
 2. SHINKO ELECTRIC INDUSTRIES CO., LTD.     ...p148
 3. KYOCERA Corporation     ...p154
 4. TOPPAN Inc.     ...p159
 5. UNIMICRON Technology Corporation     ...p165
 6. Nan Ya Printed Circuit Board Corporation     ...p171
 7. KINSUS Interconnect Technology Corporation     ...p177
 8. Zhen Ding Technology Holding Limited     ...p181
 9. Samsung Electro-Mechanics Co., Ltd.     ...p185
10. SIMMTECH Co., Ltd.      ...p190
11. DAEDUCK Electronics Co., Ltd.      ...p194
12. LG Innotek Co., Ltd.     ...p199
13. KOREA CIRCUIT CO., LTD     ...p203
14. AT & S Austria Technologie & Systemtechnik AG     ...p207
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