Power Modules & Component Materials 2017
Date | Published on 15 December, 2017 |
Price | Hard copy only:270,000JPY Hard Copy & Soft Copy(CD-ROM):290,000JPY |
Size | A4 x 230 pages |
 | *To check the detail by PDF file
|
Focal points of this report
- Power Modules
- Market Trends of IGBT power module and SiC power modul
- By application, by module capacity and by packaging technolog
-By SiC and Si-base chips - Core technology trends for high reliability of module
- Trends of new lineup and expansion of the module manufacturer
- Alternative technologies of bonding wire, solder join and ceramic substrate with metal baseplate
- Module component materials
- Ceramic substrat
- Market Trends by application and by substrate materia
- Trends of the substrate material market by application market trend - Sinter joining materia
- Market Trends of Ag sintering materials by application, by type (W/ or W/o resin
- Development status by supplier
* Specifications and performances of products
* Development situations of Cu and Ni sintering material
Table of Contents
Chapter 1 Executive Summary [P2-15]
1. Overview of the power module market
2. Overview of SiC power module market
3. Overview of technology trends of the power modules
4. Market entry, movement of integrations and other activities by module business companies, classified by capacity
5. Trend analysis of major power module companies
6. Market overview of ceramic substrates for power devices
7. Market overview of sinter joining material
2. Overview of SiC power module market
3. Overview of technology trends of the power modules
4. Market entry, movement of integrations and other activities by module business companies, classified by capacity
5. Trend analysis of major power module companies
6. Market overview of ceramic substrates for power devices
7. Market overview of sinter joining material
Chapter 2 Trends of power modules
1. Outline of power device basics [P17-23]
1.1 Functions of power devices
1.2 Outlines of major power devices and their characteristics
1.3 Capacities and frequencies of power devices classified by types
1.4 Coverage of power electronics equipment and power devices
1.5 SiC/GaN power devices
1.2 Outlines of major power devices and their characteristics
1.3 Capacities and frequencies of power devices classified by types
1.4 Coverage of power electronics equipment and power devices
1.5 SiC/GaN power devices
2. Development trends of power semiconductor chips [P24-26]
2.1 Next-generation IGBT chips
2.2 RC-IGBT chip
2.3 Trench-type SiC-MOSFET
2.2 RC-IGBT chip
2.3 Trench-type SiC-MOSFET
3. Basic types of the power modules [P27-36]
3.1 Capacity and internal circuit of IGBT modules
3.2 Compatible modules classified by power capacity
3.3 Next-generation high-capacity power modules in 2-in-1 packages
3.2 Compatible modules classified by power capacity
3.3 Next-generation high-capacity power modules in 2-in-1 packages
4. Package technology of power modules [P37-45]
4.1 Basic functions and required characteristics of packages
4.2 Typical structures of power modules
4.3 Reliability and joining parts of power modules
4.4 Alternative technologies for bonding wire connection
4.5 Alternative technology of solder joint
4.6 Joining with Ag sintering material
4.7 Packaging technology of substrates unified with baseplate
4.8 List of activities by major module companies for high-reliability packaging technologies
4.2 Typical structures of power modules
4.3 Reliability and joining parts of power modules
4.4 Alternative technologies for bonding wire connection
4.5 Alternative technology of solder joint
4.6 Joining with Ag sintering material
4.7 Packaging technology of substrates unified with baseplate
4.8 List of activities by major module companies for high-reliability packaging technologies
5. Situation of market entry of power module companies [P46-71]
5.1 List of market entry situation of IGBT module companies
5.2 Situation classified by capacity and circuit, and classified by companies who entered the market, for IGBT modules
5.3 Situation classified by capacity and circuit, of companies who entered the IPM market
5.4 List of situation of companies, who entered the SiC module market
5.5 Situation classified by capacity and circuit, of companies who entered the SiC market
5.2 Situation classified by capacity and circuit, and classified by companies who entered the market, for IGBT modules
5.3 Situation classified by capacity and circuit, of companies who entered the IPM market
5.4 List of situation of companies, who entered the SiC module market
5.5 Situation classified by capacity and circuit, of companies who entered the SiC market
*List of surveyed companies of 5.2, 5.3 and 5.5, Chapter 2
Mitsubishi Electric, Infineon, Fuji Electric, Semikron, On Semiconductor,
Hitachi Power Semiconductor Device, Sanken Electric, ABB, Microsemi,
Vishay, IXYS, Kyocera, STM, Wolfspeed, Rohm, Others
Mitsubishi Electric, Infineon, Fuji Electric, Semikron, On Semiconductor,
Hitachi Power Semiconductor Device, Sanken Electric, ABB, Microsemi,
Vishay, IXYS, Kyocera, STM, Wolfspeed, Rohm, Others
6. Market trends of the power modules [P72-121]
6.1 Market size in 2016 and various breakdowns
6.2 Trends of major companies (2016)
6.3 Forecast of the changes of market size
6.2 Trends of major companies (2016)
6.3 Forecast of the changes of market size
7. Market trends of the SiC power modules [P122-165]
7.1 Market size in 2016 and various breakdowns
7.2 Trends of major companies (2016)
7.3 Estimated changes in market size
7.2 Trends of major companies (2016)
7.3 Estimated changes in market size
7.3.1 Total market classified by SiC and Si base
7.3.2 SiC base market
7.3.2 SiC base market
Chapter 3 Trends of main components
I. Ceramic substrate for power device [P168-193]
1. Product overview
1. Product overview
1.1 Ceramic substrate material
1.2 Metallization method
1.2 Metallization method
2. Industry Overview
2.1 Situation of entry to the market of ceramic substrates for power devices
2.2 Situation of entry to the market of metalized substrates
2.2 Situation of entry to the market of metalized substrates
3. Sales results of major companies
3.1 Results in value terms (2016)
3.2 Results in volume terms (2016)
3.2 Results in volume terms (2016)
4. Market trends (current status and forecast)
4.1 Market size of ceramic substrate, classified by application (2016)
4.2 Forecast of the market size of ceramic substrates
4.2 Forecast of the market size of ceramic substrates
4.2.1 Classified by substrate material
4.2.2 Classified by application segments
4.2.2 Classified by application segments
*List of surveyed companies of I, Chapter 3
Denka, Toshiba Material, DOWA Metaltech, Mitsubishi Materials, Kyocera, NGK,
Hitachi Metals, Rogers, KCC
Denka, Toshiba Material, DOWA Metaltech, Mitsubishi Materials, Kyocera, NGK,
Hitachi Metals, Rogers, KCC
II. Sinter joining material [P194-219]
1. Technical overview of sinter joining materials
1. Technical overview of sinter joining materials
1.1 Background of demands for sinter joining materials
1.2 Overview of sinter joining materials for power devices
1.2 Overview of sinter joining materials for power devices
2. Companies, who entered the market of sinter joining material and their products
2.1 List of companies, who entered the market
2.2 Material specifications of major companies
2.3 Performance specifications of the materials of major companies
2.2 Material specifications of major companies
2.3 Performance specifications of the materials of major companies
3. Market overview of sinter joining material
3.1 Market in 2016 and trends of major companies
3.2 Estimate changes in market size
3.2 Estimate changes in market size
*List of surveyed companies of II, Chapter 3
Alent, Henkel, Heraeus, Nihon Handa, Namics, Kyocera, Hitachi Chemical,
Sumitomo Bakelite, DOWA Electronics Materials, Sneju, Tanaka, Nihon Superior,
Harima Chemicals, Mitsui Mining & Smelting, Mitsubishi Materials, Others
Alent, Henkel, Heraeus, Nihon Handa, Namics, Kyocera, Hitachi Chemical,
Sumitomo Bakelite, DOWA Electronics Materials, Sneju, Tanaka, Nihon Superior,
Harima Chemicals, Mitsui Mining & Smelting, Mitsubishi Materials, Others
Chapter 4 Trends of applications
1. HEV/EV [P221-228]
1.1 Trends of tightening of regulations against CO2 exhaust
1.2 Size of sales of automobiles by country and movement of regulation tightening of engine driven automobiles
1.3 ZEV regulation
1.4 Movements and plans of automobile manufacturers for the shift to electric vehicles
1.5 Sales volumes and market shares of xEV by manufactures
1.6 Forecast of changes of market size of xEV
1.2 Size of sales of automobiles by country and movement of regulation tightening of engine driven automobiles
1.3 ZEV regulation
1.4 Movements and plans of automobile manufacturers for the shift to electric vehicles
1.5 Sales volumes and market shares of xEV by manufactures
1.6 Forecast of changes of market size of xEV
2. References [P229-230]
2.1 Changes in the scales of installed capacity of wind power generation
2.2 Changes in the scales of installed capacity of solar power generation
2.2 Changes in the scales of installed capacity of solar power generation
