*Express Mailing Service (EMS) & Handling Included: If you prefer Fedex, additional costs are needed.
*The prices shown in each report limit the data use range to the same corporation you applied for.
Please contact us in advance if you would like to use the report in multiple group companies. We would quote the multi-license price.
Power Module & Ceramic Substrate Report 2021 | 334pages, A4 Size | Hard Copy + Soft Copy: JPY520,000- |
Solder Resist Report 2021 | 171pages, A4 Size | Hard Copy + Soft Copy: JPY400,000- |
Market Report on High Speed / High frequency PCB Materials for Mobile | 362pages, A4 Size | Hard Copy + Soft Copy: JPY620,000- |
Power Module Report 2020 | 226pages, A4 Size | Hard Copy only: JPY370,000- Hard Copy + Soft Copy: JPY400,000- |
CCL Report 2020 | 278pages,A4 size | Hard Copy only: JPY380,000- Hard Copy + Soft Copy: JPY400,000- |
Trends of Advanced IC packages in Data Center Era and the materials | 327pages, A4 Size | Hard Copy + Soft Copy: JPY570,000- |
MSAP PCB & ETS Report 2020 | 352pages, A4 Size | Hard Copy + Soft Copy: JPY520,000- |
PCB Report 2020 | 276pages, A4 Size | Hard Copy only: JPY270,000
Hard Copy + Soft Copy: JPY300,000- |
FCCL Report 2020 | 290pages, A4 Size | Hard Copy + Soft Copy: JPY510,000- |
Market Research on Thermal Interface Material (TIM) & Thermally Conductive Filler 2020 | 230pages, A4 Size | Hard Copy only: JPY250,000-
Hard Copy + Soft Copy: JPY270,000- |
IC Package Substrate Report 2019 | 210pages, A4 Size | Hard Copy + Soft Copy: JPY290,000- |
Market Research on Power Control Unit for EV
| 251pages, A4 Size | Hard Copy + Soft Copy: JPY560,000- |
Fan-Out-Panel-Level Package Report 2019 | 180pages, A4 Size | 180pages, A4 Size |
The Market and Technological Trend for High-frequency Film | 252pages, A4 Size | Hard Copy + Soft Copy: JPY550,000- |
FPC & Rigid-Flex PCB Report 2018 | 446pages, A4 Size | Hard Copy only: JPY510,000- Hard Copy + Soft Copy: JPY530,000- |
Substrate-Like PCB Report 2018 | 184pages, A4 Size | Hard Copy + Soft Copy:JPY520,000 |
Power Modules & Component Materials 2017 | 230pages, A4 Size | Hard copy only: JPY270,000
Hard copy + Soft copy: JPY290,000 |
FCCL Report 2017 | 250pages, A4 Size | Hard copy only: JPY400,000
Hard Copy + Soft Copy:JPY420,000 |
Solder Resist Report 2017 | 142pages, A4 Size | Hard copy only: JPY300,000
Hard copy + Soft copy: JPY320,000 |
FO-WLP & Encapsulant Report | 182pages, A4 Size | Hard Copy + Soft Copy:JPY530,000 |
FPC & Rigid-Flex PCB Report 2016 | 436pages, A4 Size | Hard copy only: JPY510,000
Hard copy + Soft copy: JPY530,000 |
CCL REPORT 2016 | 270pages, A4 Size | Hard copy only: JPY280,000
Hard Copy + Soft Copy:JPY300,000 |
FO-WLP and RDL Dielectric Material | 166pages, A4 Size | Hard Copy + Soft Copy:JPY580,000 |
PCB Report 2015 | 224pages, A4 Size | Hard copy only: JPY210,000
Hard Copy + Soft Copy:JPY230,000 |
FPC & FCCL Outlook Report | 62pages, A4 Size | Hard copy only: JPY92,000 |
IC Substrate Report 2015 | 100pages, A4 Size | Hard Copy + Soft Copy:JPY140,000 |
Flip Chip Substrate Report 2015 | 162pages, A4 Size | Hard Copy + Soft Copy:JPY300,000 |
Build-Up PCB Report 2014 | 483pages, A4 Size | Hard copy only: JPY210,000
Hard copy + Soft copy: JPY230,000 |
Market Analysis for Metal Base PCB 2015 | 163pages, A4 Size | Hard copy only: JPY210,000
Hard Copy + Soft Copy:JPY230,000 |
Outlook of Thermal Interface Material(TIM) Market 2015 | 108pages, A4 Size | Hard copy only: JPY210,000
Hard copy + Soft copy: JPY230,000 |
Market Research on PCB for Automotive 2014 | 215pages, A4 Size | Hard copy only: JPY210,000
Hard copy + Soft copy: JPY230,000 |
